3/1/2016, the successful completion of the PAM4 modulation technique of 100 km 400Gbps transmission based on optical transmission equipment manufacturer ADVA said Germany and Technical University of Denmark day before. The experiment is based on 8 channel 50Gbps transmission scheme for the data center interconnect market provides a different from the traditional coherent transmission of low-cost solutions. ADVA and Technical University of Denmark will report on the OFC this year, the specific technical details of the experiment, the report entitled the data center for the first time connected to the real time 400G PAM4 100 km SSMF fiber 1550nm wavelength transmission". The authors are Nicklas Eiselt, Jinlong Wei, Helmut Grisser, Annika Dochan, Michael H. Eiselt, Joerg-Peter Elbers, Juan Jose Vegas Olomos and Idelfonso Tafur Monroy Mary Curie ABACUS and CEEOLAN EU project sponsored this transmission test.
One of the authors, Technical University of Denmark Photonics Engineering doctoral student, Nicklas Eiselt said that their unique PAM4 modulation scheme is to realize the economic and efficient low-power high-speed DCI solutions, and greatly improves the transmission distance of 400Gbps PAM4. 400G PAM4 is currently working on the standardization of the IEEE 802.3bs workgroup.
The key to realize the real-time transmission of PAM4 signal at 100 km distance is the new transceiver which is installed at the transmitter and receiver. These equalizers are designed to compensate for limited bandwidth and residual dispersion. The test uses 80 km and 100 km of standard single mode fiber SSMF, multiplexer and demultiplexer and optical amplifier to simulate the actual DCI application environment.
Eiselt said the success of the experiment verified the feasibility of PAM4 as a low-cost, high-speed data center interconnection. Based on this technology in the future can also achieve more than 100 kilometers of 4Tbps transmission capacity. For them, the next step will be the first to achieve the legend under the 56Gbaud, and further integration in the device level to further reduce power consumption and c
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